It is the season of Pre MWC leaks and teasers and now we have another episode to add to that that saga. Sony’s high-end Android smartphone Xperia SP( C530X) has been leaked in detail ahead of the Mobile World Congress.
Codenamed “HuaShan”, Xperia SP is expected to come with a 4.6-inch 720p display along with a 1.7 GHz dual core Qualcomm Snapdragon S4 Pro MSM8960T processor with Adreno 320. It will feature an 8MP Exmor RS camera sensor and 8GB of internal storage. The phone would provide an option for microSD slot. Measuring in at 130.6 x 67.1 x 9.98mm the phone will weigh 155g. Oh and the phone will have an aluminium frame, something that is associated with premium looks these days.
The phone will be announced at MWC next week along with other surprises Sony has in its bag for us.